BibTeX records: Melina Lofrano

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@inproceedings{DBLP:conf/irps/DingPLZCFWC23,
  author       = {Youqi Ding and
                  O. Varela Pedreira and
                  Melina Lofrano and
                  Houman Zahedmanesh and
                  T. Chavez and
                  Hosain Farr and
                  Ingrid De Wolf and
                  Kris Croes},
  title        = {Thermomigration-induced void formation in Cu-interconnects - Assessment
                  of main physical parameters},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10117870},
  doi          = {10.1109/IRPS48203.2023.10117870},
  timestamp    = {Wed, 24 May 2023 09:43:44 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/DingPLZCFWC23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/LofranoOCVPLCCCPT23,
  author       = {Melina Lofrano and
                  Herman Oprins and
                  Xinyue Chang and
                  Bjorn Vermeersch and
                  Olalla Varela Pedreira and
                  Alicja Lesniewska and
                  Vladimir Cherman and
                  Ivan Ciofi and
                  Kristof Croes and
                  Seongho Park and
                  Zsolt Tokei},
  title        = {Towards accurate temperature prediction in {BEOL} for reliability
                  assessment (Invited)},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10117701},
  doi          = {10.1109/IRPS48203.2023.10117701},
  timestamp    = {Wed, 24 May 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LofranoOCVPLCCCPT23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/MishraVVBLAOBZHPWHMCR23,
  author       = {Subrat Mishra and
                  Sankatali Venkateswarlu and
                  Bjorn Vermeersch and
                  Moritz Brunion and
                  Melina Lofrano and
                  Dawit Burusie Abdi and
                  Herman Oprins and
                  Dwaipayan Biswas and
                  Odysseas Zografos and
                  Gaspard Hiblot and
                  Geert Van der Plas and
                  Pieter Weckx and
                  Geert Hellings and
                  James Myers and
                  Francky Catthoor and
                  Julien Ryckaert},
  title        = {Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips
                  (SOCs)},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10117979},
  doi          = {10.1109/IRPS48203.2023.10117979},
  timestamp    = {Mon, 05 Feb 2024 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/irps/MishraVVBLAOBZHPWHMCR23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/PedreiraLZRVSCC22,
  author       = {O. Varela Pedreira and
                  Melina Lofrano and
                  Houman Zahedmanesh and
                  Philippe J. Roussel and
                  Marleen H. van der Veen and
                  Veerle Simons and
                  Emmanuel Chery and
                  Ivan Ciofi and
                  Kris Croes},
  title        = {Assessment of critical Co electromigration parameters},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2022, Dallas,
                  TX, USA, March 27-31, 2022},
  pages        = {8},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/IRPS48227.2022.9764427},
  doi          = {10.1109/IRPS48227.2022.9764427},
  timestamp    = {Mon, 01 May 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/PedreiraLZRVSCC22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/LesniewskaPLMVD21,
  author       = {Alicja Lesniewska and
                  Olalla Varela Pedreira and
                  Melina Lofrano and
                  Gayle Murdoch and
                  Marleen H. van der Veen and
                  Anish Dangol and
                  Naoto Horiguchi and
                  Zsolt T{\"{o}}kei and
                  Kris Croes},
  title        = {Reliability of a {DME} Ru Semidamascene scheme with 16 nm wide Airgaps},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2021, Monterey,
                  CA, USA, March 21-25, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/IRPS46558.2021.9405192},
  doi          = {10.1109/IRPS46558.2021.9405192},
  timestamp    = {Mon, 01 May 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LesniewskaPLMVD21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LofranoCGB18,
  author       = {Melina Lofrano and
                  Vladimir Cherman and
                  Mario Gonzalez and
                  Eric Beyne},
  title        = {Enhanced Cu pillar design to reduce thermomechanical stress induced
                  during flip chip assembly},
  journal      = {Microelectron. Reliab.},
  volume       = {87},
  pages        = {97--105},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.06.004},
  doi          = {10.1016/J.MICROREL.2018.06.004},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/LofranoCGB18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/CroesCLZKGWTB18,
  author       = {Kristof Croes and
                  Vladimir Cherman and
                  Melina Lofrano and
                  Houman Zahedmanesh and
                  Luka Kljucar and
                  Mario Gonzalez and
                  Ingrid De Wolf and
                  Zsolt T{\"{o}}kei and
                  Eric Beyne},
  title        = {Stress mitigation of 3D-stacking/packaging induced stresses},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {4},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353590},
  doi          = {10.1109/IRPS.2018.8353590},
  timestamp    = {Fri, 02 Dec 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/irps/CroesCLZKGWTB18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/VandeveldeIDLVGCGPWBT14,
  author       = {Bart Vandevelde and
                  Andrej Ivankovic and
                  B. Debecker and
                  Melina Lofrano and
                  Kris Vanstreels and
                  Wei Guo and
                  Vladimir Cherman and
                  Marcel Gonzalez and
                  Geert Van der Plas and
                  Ingrid De Wolf and
                  Eric Beyne and
                  Zsolt Tokei},
  title        = {Chip-Package Interaction in 3D stacked {IC} packages using Finite
                  Element Modelling},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {6-7},
  pages        = {1200--1205},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.02.026},
  doi          = {10.1016/J.MICROREL.2014.02.026},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/VandeveldeIDLVGCGPWBT14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/mr/LofranoCWW11,
  author       = {Melina Lofrano and
                  Kris Croes and
                  Ingrid De Wolf and
                  Christopher J. Wilson},
  title        = {Influence of test structure design on stress-induced-voiding using
                  an experimentally validated Finite Element Modeling approach},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {9-11},
  pages        = {1578--1581},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2011.07.068},
  doi          = {10.1016/J.MICROREL.2011.07.068},
  timestamp    = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LofranoCWW11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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