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BibTeX records: Hisashi Kino
@inproceedings{DBLP:conf/3dic/ShenLHSKTMKF23, author = {Jiayi Shen and Chang Liu and Tadaaki Hoshi and Atsushi Sinoda and Hisashi Kino and Tetsu Tanaka and Mariappan Murugesan and Mitsumasa Koyanagi and Takafumi Fukushima}, title = {Impact of Super-long-throw {PVD} on {TSV} Metallization and Die-to-Wafer 3D Integration Based on Via-last}, booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023}, pages = {1--4}, publisher = {{IEEE}}, year = {2023}, url = {https://doi.org/10.1109/3DIC57175.2023.10154930}, doi = {10.1109/3DIC57175.2023.10154930}, timestamp = {Mon, 10 Jul 2023 15:09:43 +0200}, biburl = {https://dblp.org/rec/conf/3dic/ShenLHSKTMKF23.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/NakamuraDSHKFKT23, author = {Kohei Nakamura and Bang Du and Keishun Sugishita and Ryo Hasegawa and Hisashi Kino and Takafumi Fukushima and Koji Kiyoyama and Tetsu Tanaka}, title = {Development of Trans-nail {PPG} Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction}, booktitle = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2023, Toronto, ON, Canada, October 19-21, 2023}, pages = {1--4}, publisher = {{IEEE}}, year = {2023}, url = {https://doi.org/10.1109/BioCAS58349.2023.10389082}, doi = {10.1109/BIOCAS58349.2023.10389082}, timestamp = {Thu, 08 Feb 2024 15:34:19 +0100}, biburl = {https://dblp.org/rec/conf/biocas/NakamuraDSHKFKT23.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/ieiceee/LiangDNWIAKFKT22, author = {Yaogan Liang and Bang Du and Kohei Nakamura and Shengwei Wang and Bunta Inoue and Yuta Aruga and Hisashi Kino and Takafumi Fukushima and Koji Kiyoyama and Tetsu Tanaka}, title = {3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration}, journal = {{IEICE} Electron. Express}, volume = {19}, number = {23}, pages = {20220363}, year = {2022}, url = {https://doi.org/10.1587/elex.19.20220363}, doi = {10.1587/ELEX.19.20220363}, timestamp = {Wed, 15 Feb 2023 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/ieiceee/LiangDNWIAKFKT22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/NakamuraLDWAIKF22, author = {Kohei Nakamura and Yaogan Liang and Bang Du and Shengwei Wang and Yuta Aruga and Bunta Inoue and Hisashi Kino and Takafumi Fukushima and Koji Kiyoyama and Tetsu Tanaka}, title = {Implementation of Light and Dark Adaptation Function for High {QOL} 3D-Stacked Artificial Retina Chip}, booktitle = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2022, Taipei, Taiwan, October 13-15, 2022}, pages = {519--523}, publisher = {{IEEE}}, year = {2022}, url = {https://doi.org/10.1109/BioCAS54905.2022.9948542}, doi = {10.1109/BIOCAS54905.2022.9948542}, timestamp = {Tue, 22 Nov 2022 09:54:51 +0100}, biburl = {https://dblp.org/rec/conf/biocas/NakamuraLDWAIKF22.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/FukushimaSTHBMK21, author = {Takafumi Fukushima and Shinichi Sakuyama and Masatomo Takahashi and Hiroyuki Hashimoto and Jichoel Bea and Theodorus Marcello and Hisashi Kino and Tetsu Tanaka and Mitsumasa Koyanagi and Mariappan Murugesan}, title = {Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing}, booktitle = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021}, pages = {1--4}, publisher = {{IEEE}}, year = {2021}, url = {https://doi.org/10.1109/3DIC52383.2021.9687601}, doi = {10.1109/3DIC52383.2021.9687601}, timestamp = {Fri, 18 Feb 2022 10:36:41 +0100}, biburl = {https://dblp.org/rec/conf/3dic/FukushimaSTHBMK21.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/LianaQDYNWKFKT21, author = {Yaogan Liana and Zhengyang Qian and Bang Du and Jinming Ye and Kohei Nakamura and Shengwei Wang and Hisashi Kino and Takafumi Fukushima and Koji Kiyoyama and Tetsu Tanaka}, editor = {Roland Thewes}, title = {Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System}, booktitle = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2021, Berlin, Germany, October 7-9, 2021}, pages = {1--4}, publisher = {{IEEE}}, year = {2021}, url = {https://doi.org/10.1109/BioCAS49922.2021.9645034}, doi = {10.1109/BIOCAS49922.2021.9645034}, timestamp = {Thu, 06 Jan 2022 15:46:39 +0100}, biburl = {https://dblp.org/rec/conf/biocas/LianaQDYNWKFKT21.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/KinoFT19, author = {Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058838}, doi = {10.1109/3DIC48104.2019.9058838}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/KinoFT19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/KiyoyamaZHKFT19, author = {Koji Kiyoyama and Qian Zhengy and Hiroyuki Hashimoto and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Development of a {CDS} Circuit for 3-D Stacked Neural Network Chip using {CMOS} Analog Signal Processing}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058856}, doi = {10.1109/3DIC48104.2019.9058856}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/KiyoyamaZHKFT19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/LeeSQTKTF19, author = {Sungho Lee and Yuki Susumago and Zhengyang Qian and Noriyuki Takahashi and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima}, title = {Development of 3D-IC Embedded Flexible Hybrid System}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058880}, doi = {10.1109/3DIC48104.2019.9058880}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/LeeSQTKTF19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/LiangLMKMKFT19, author = {Rui Liang and Sungho Lee and Yuki Miwa and Kousei Kumahara and Mariappan Murugesan and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature {TSV} Liner Formation}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058843}, doi = {10.1109/3DIC48104.2019.9058843}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/LiangLMKMKFT19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/MiwaLLKKFT19, author = {Yuki Miwa and Sungho Lee and Rui Liang and Kousei Kumahara and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058841}, doi = {10.1109/3DIC48104.2019.9058841}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/MiwaLLKKFT19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/YabukiTQLDSFKFK19, author = {Ryosuke Yabuki and Tetsu Tanaka and Zhengyang Qian and Kar Mun Lee and Bang Du and Filipe Alves Satake and Tasuku Fukushima and Hisashi Kino and Takafumi Fukushima and Koji Kiyoyama}, title = {{PPG} and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System}, booktitle = {2019 {IEEE} Biomedical Circuits and Systems Conference, BioCAS 2019, Nara, Japan, October 17-19, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/BIOCAS.2019.8919027}, doi = {10.1109/BIOCAS.2019.8919027}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/biocas/YabukiTQLDSFKFK19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/LeeQYDKFKT18, author = {Kar Mun Lee and Zhengyang Qian and Ryosuke Yabuki and Bang Du and Hisashi Kino and Takafumi Fukushima and Koji Kiyoyama and Tetsu Tanaka}, title = {Continuous Peripheral Blood Pressure Measurement with {ECG} and {PPG} Signals at Fingertips}, booktitle = {2018 {IEEE} Biomedical Circuits and Systems Conference, BioCAS 2018, Cleveland, OH, USA, October 17-19, 2018}, pages = {1--4}, publisher = {{IEEE}}, year = {2018}, url = {https://doi.org/10.1109/BIOCAS.2018.8584776}, doi = {10.1109/BIOCAS.2018.8584776}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/biocas/LeeQYDKFKT18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/ShimokawaQTKFKT17, author = {Kenji Shimokawa and Zhengyang Qian and Yoshiki Takezawa and Hisashi Kino and Takafumi Fukushima and Kouji Kiyoyama and Tetsu Tanaka}, title = {Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip}, booktitle = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2017, Torino, Italy, October 19-21, 2017}, pages = {1--4}, publisher = {{IEEE}}, year = {2017}, url = {https://doi.org/10.1109/BIOCAS.2017.8325552}, doi = {10.1109/BIOCAS.2017.8325552}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/biocas/ShimokawaQTKFKT17.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/TakezawaKSQKFT17, author = {Yoshiki Takezawa and Koji Kiyoyama and Kenji Shimokawa and Zhengyang Qian and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current}, booktitle = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2017, Torino, Italy, October 19-21, 2017}, pages = {1--4}, publisher = {{IEEE}}, year = {2017}, url = {https://doi.org/10.1109/BIOCAS.2017.8325165}, doi = {10.1109/BIOCAS.2017.8325165}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/biocas/TakezawaKSQKFT17.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/micromachines/FukushimaHYKMBL16, author = {Takafumi Fukushima and Hideto Hashiguchi and Hiroshi Yonekura and Hisashi Kino and Mariappan Murugesan and Ji Chel Bea and Kang Wook Lee and Tetsu Tanaka and Mitsumasa Koyanagi}, title = {Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration}, journal = {Micromachines}, volume = {7}, number = {10}, pages = {184}, year = {2016}, url = {https://doi.org/10.3390/mi7100184}, doi = {10.3390/MI7100184}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/micromachines/FukushimaHYKMBL16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/KinoFT16, author = {Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka}, title = {Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler}, booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016}, pages = {1--4}, publisher = {{IEEE}}, year = {2016}, url = {https://doi.org/10.1109/3DIC.2016.7970031}, doi = {10.1109/3DIC.2016.7970031}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/KinoFT16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/biocas/KiyoyamaTGIUSNK16, author = {Koji Kiyoyama and Yoshiki Takezawa and Tatsuya Goto and Keita Ito and Shoma Uno and Kenji Shimokawa and Satoru Nishino and Hisashi Kino and Tetsu Tanaka}, title = {Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current}, booktitle = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2016, Shanghai, China, October 17-19, 2016}, pages = {304--307}, publisher = {{IEEE}}, year = {2016}, url = {https://doi.org/10.1109/BioCAS.2016.7833792}, doi = {10.1109/BIOCAS.2016.7833792}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/biocas/KiyoyamaTGIUSNK16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/TanikawaKFKT15, author = {Seiya Tanikawa and Hisashi Kino and Takafumi Fukushima and Mitsumasa Koyanagi and Tetsu Tanaka}, title = {Novel local stress evaluation method in 3D {IC} using {DRAM} cell array with planar mOS capacitors}, booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015}, pages = {TS3.1.1--TS3.1.4}, publisher = {{IEEE}}, year = {2015}, url = {https://doi.org/10.1109/3DIC.2015.7334557}, doi = {10.1109/3DIC.2015.7334557}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/TanikawaKFKT15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/KinoHTSIFKT15, author = {Hisashi Kino and Hideto Hashiguchi and Seiya Tanikawa and Yohei Sugawara and Shunsuke Ikegaya and Takafumi Fukushima and Mitsumasa Koyanagi and Tetsu Tanaka}, title = {Consideration of microbump layout for reduction of local bending stress due to {CTE} Mismatch in 3D {IC}}, booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015}, pages = {TS8.26.1--TS8.26.4}, publisher = {{IEEE}}, year = {2015}, url = {https://doi.org/10.1109/3DIC.2015.7334596}, doi = {10.1109/3DIC.2015.7334596}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/KinoHTSIFKT15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/embc/KannoLHKKMYT13, author = {Shota Kanno and Sang{-}Rim Lee and T. Harashima and Toshinobu Kuki and Hisashi Kino and Hajime Mushiake and Hongyi Yao and Tetsu Tanaka}, title = {Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics}, booktitle = {35th Annual International Conference of the {IEEE} Engineering in Medicine and Biology Society, {EMBC} 2013, Osaka, Japan, July 3-7, 2013}, pages = {253--256}, publisher = {{IEEE}}, year = {2013}, url = {https://doi.org/10.1109/EMBC.2013.6609485}, doi = {10.1109/EMBC.2013.6609485}, timestamp = {Sun, 31 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/embc/KannoLHKKMYT13.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@inproceedings{DBLP:conf/3dic/BeaMONKLFTK09, author = {Ji Chel Bea and Mariappan Murugesan and Yuki Ohara and Akihiro Noriki and Hisashi Kino and Kang Wook Lee and Takafumi Fukushima and Tetsu Tanaka and Mitsumasa Koyanagi}, title = {Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009}, pages = {1--5}, publisher = {{IEEE}}, year = {2009}, url = {https://doi.org/10.1109/3DIC.2009.5306568}, doi = {10.1109/3DIC.2009.5306568}, timestamp = {Sat, 30 Sep 2023 01:00:00 +0200}, biburl = {https://dblp.org/rec/conf/3dic/BeaMONKLFTK09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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