BibTeX records: Hisashi Kino

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@inproceedings{DBLP:conf/3dic/ShenLHSKTMKF23,
  author       = {Jiayi Shen and
                  Chang Liu and
                  Tadaaki Hoshi and
                  Atsushi Sinoda and
                  Hisashi Kino and
                  Tetsu Tanaka and
                  Mariappan Murugesan and
                  Mitsumasa Koyanagi and
                  Takafumi Fukushima},
  title        = {Impact of Super-long-throw {PVD} on {TSV} Metallization and Die-to-Wafer
                  3D Integration Based on Via-last},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2023,
                  Cork, Ireland, May 10-12, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/3DIC57175.2023.10154930},
  doi          = {10.1109/3DIC57175.2023.10154930},
  timestamp    = {Mon, 10 Jul 2023 15:09:43 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ShenLHSKTMKF23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/NakamuraDSHKFKT23,
  author       = {Kohei Nakamura and
                  Bang Du and
                  Keishun Sugishita and
                  Ryo Hasegawa and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Koji Kiyoyama and
                  Tetsu Tanaka},
  title        = {Development of Trans-nail {PPG} Controller Using Fingertip Blood Volume
                  Changes to Enable Highly Accurate Motion Prediction},
  booktitle    = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2023, Toronto,
                  ON, Canada, October 19-21, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/BioCAS58349.2023.10389082},
  doi          = {10.1109/BIOCAS58349.2023.10389082},
  timestamp    = {Thu, 08 Feb 2024 15:34:19 +0100},
  biburl       = {https://dblp.org/rec/conf/biocas/NakamuraDSHKFKT23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/ieiceee/LiangDNWIAKFKT22,
  author       = {Yaogan Liang and
                  Bang Du and
                  Kohei Nakamura and
                  Shengwei Wang and
                  Bunta Inoue and
                  Yuta Aruga and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Koji Kiyoyama and
                  Tetsu Tanaka},
  title        = {3D-stacked retinal prosthesis chip with binary image capture and edge
                  detection functions for human visual restoration},
  journal      = {{IEICE} Electron. Express},
  volume       = {19},
  number       = {23},
  pages        = {20220363},
  year         = {2022},
  url          = {https://doi.org/10.1587/elex.19.20220363},
  doi          = {10.1587/ELEX.19.20220363},
  timestamp    = {Wed, 15 Feb 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/ieiceee/LiangDNWIAKFKT22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/NakamuraLDWAIKF22,
  author       = {Kohei Nakamura and
                  Yaogan Liang and
                  Bang Du and
                  Shengwei Wang and
                  Yuta Aruga and
                  Bunta Inoue and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Koji Kiyoyama and
                  Tetsu Tanaka},
  title        = {Implementation of Light and Dark Adaptation Function for High {QOL}
                  3D-Stacked Artificial Retina Chip},
  booktitle    = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2022, Taipei,
                  Taiwan, October 13-15, 2022},
  pages        = {519--523},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/BioCAS54905.2022.9948542},
  doi          = {10.1109/BIOCAS54905.2022.9948542},
  timestamp    = {Tue, 22 Nov 2022 09:54:51 +0100},
  biburl       = {https://dblp.org/rec/conf/biocas/NakamuraLDWAIKF22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaSTHBMK21,
  author       = {Takafumi Fukushima and
                  Shinichi Sakuyama and
                  Masatomo Takahashi and
                  Hiroyuki Hashimoto and
                  Jichoel Bea and
                  Theodorus Marcello and
                  Hisashi Kino and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi and
                  Mariappan Murugesan},
  title        = {Integration of Damage-less Probe Cards Using Nano-TSV Technology for
                  Microbumped Wafer Testing},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687601},
  doi          = {10.1109/3DIC52383.2021.9687601},
  timestamp    = {Fri, 18 Feb 2022 10:36:41 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FukushimaSTHBMK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/LianaQDYNWKFKT21,
  author       = {Yaogan Liana and
                  Zhengyang Qian and
                  Bang Du and
                  Jinming Ye and
                  Kohei Nakamura and
                  Shengwei Wang and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Koji Kiyoyama and
                  Tetsu Tanaka},
  editor       = {Roland Thewes},
  title        = {Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation
                  for Artificial Vision System},
  booktitle    = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2021, Berlin,
                  Germany, October 7-9, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/BioCAS49922.2021.9645034},
  doi          = {10.1109/BIOCAS49922.2021.9645034},
  timestamp    = {Thu, 06 Jan 2022 15:46:39 +0100},
  biburl       = {https://dblp.org/rec/conf/biocas/LianaQDYNWKFKT21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KinoFT19,
  author       = {Hisashi Kino and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  title        = {Investigation of the Underfill with Negative-Thermal-Expansion Material
                  to Suppress Mechanical Stress in 3D Integration System},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058838},
  doi          = {10.1109/3DIC48104.2019.9058838},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KinoFT19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KiyoyamaZHKFT19,
  author       = {Koji Kiyoyama and
                  Qian Zhengy and
                  Hiroyuki Hashimoto and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  title        = {Development of a {CDS} Circuit for 3-D Stacked Neural Network Chip
                  using {CMOS} Analog Signal Processing},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058856},
  doi          = {10.1109/3DIC48104.2019.9058856},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KiyoyamaZHKFT19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeSQTKTF19,
  author       = {Sungho Lee and
                  Yuki Susumago and
                  Zhengyang Qian and
                  Noriyuki Takahashi and
                  Hisashi Kino and
                  Tetsu Tanaka and
                  Takafumi Fukushima},
  title        = {Development of 3D-IC Embedded Flexible Hybrid System},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058880},
  doi          = {10.1109/3DIC48104.2019.9058880},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LeeSQTKTF19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LiangLMKMKFT19,
  author       = {Rui Liang and
                  Sungho Lee and
                  Yuki Miwa and
                  Kousei Kumahara and
                  Mariappan Murugesan and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  title        = {Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene
                  Radical Generation-TEOS-CVD SiO2 for Low-Temperature {TSV} Liner Formation},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058843},
  doi          = {10.1109/3DIC48104.2019.9058843},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/LiangLMKMKFT19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MiwaLLKKFT19,
  author       = {Yuki Miwa and
                  Sungho Lee and
                  Rui Liang and
                  Kousei Kumahara and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  title        = {Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch
                  Inter-Chip Connection in 3DICs},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058841},
  doi          = {10.1109/3DIC48104.2019.9058841},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/MiwaLLKKFT19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/YabukiTQLDSFKFK19,
  author       = {Ryosuke Yabuki and
                  Tetsu Tanaka and
                  Zhengyang Qian and
                  Kar Mun Lee and
                  Bang Du and
                  Filipe Alves Satake and
                  Tasuku Fukushima and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Koji Kiyoyama},
  title        = {{PPG} and SpO2 Recording Circuit with Ambient Light Cancellation for
                  Trans-Nail Pulse-Wave Monitoring System},
  booktitle    = {2019 {IEEE} Biomedical Circuits and Systems Conference, BioCAS 2019,
                  Nara, Japan, October 17-19, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/BIOCAS.2019.8919027},
  doi          = {10.1109/BIOCAS.2019.8919027},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/biocas/YabukiTQLDSFKFK19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/LeeQYDKFKT18,
  author       = {Kar Mun Lee and
                  Zhengyang Qian and
                  Ryosuke Yabuki and
                  Bang Du and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Koji Kiyoyama and
                  Tetsu Tanaka},
  title        = {Continuous Peripheral Blood Pressure Measurement with {ECG} and {PPG}
                  Signals at Fingertips},
  booktitle    = {2018 {IEEE} Biomedical Circuits and Systems Conference, BioCAS 2018,
                  Cleveland, OH, USA, October 17-19, 2018},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/BIOCAS.2018.8584776},
  doi          = {10.1109/BIOCAS.2018.8584776},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/biocas/LeeQYDKFKT18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/ShimokawaQTKFKT17,
  author       = {Kenji Shimokawa and
                  Zhengyang Qian and
                  Yoshiki Takezawa and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Kouji Kiyoyama and
                  Tetsu Tanaka},
  title        = {Experimental evaluation of stimulus current generator with Laplacian
                  edge-enhancement for 3-D stacked retinal prosthesis chip},
  booktitle    = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2017, Torino,
                  Italy, October 19-21, 2017},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/BIOCAS.2017.8325552},
  doi          = {10.1109/BIOCAS.2017.8325552},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/biocas/ShimokawaQTKFKT17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/TakezawaKSQKFT17,
  author       = {Yoshiki Takezawa and
                  Koji Kiyoyama and
                  Kenji Shimokawa and
                  Zhengyang Qian and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  title        = {Ultrawide range square wave impedance analysis circuit with ultra-slow
                  ring-oscillator using gate-induced drain-leakage current},
  booktitle    = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2017, Torino,
                  Italy, October 19-21, 2017},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/BIOCAS.2017.8325165},
  doi          = {10.1109/BIOCAS.2017.8325165},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/biocas/TakezawaKSQKFT17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/micromachines/FukushimaHYKMBL16,
  author       = {Takafumi Fukushima and
                  Hideto Hashiguchi and
                  Hiroshi Yonekura and
                  Hisashi Kino and
                  Mariappan Murugesan and
                  Ji Chel Bea and
                  Kang Wook Lee and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary
                  Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration},
  journal      = {Micromachines},
  volume       = {7},
  number       = {10},
  pages        = {184},
  year         = {2016},
  url          = {https://doi.org/10.3390/mi7100184},
  doi          = {10.3390/MI7100184},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/micromachines/FukushimaHYKMBL16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KinoFT16,
  author       = {Hisashi Kino and
                  Takafumi Fukushima and
                  Tetsu Tanaka},
  title        = {Drastic reduction of keep-out-zone in 3D-IC by local stress suppression
                  with negative-CTE filler},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970031},
  doi          = {10.1109/3DIC.2016.7970031},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KinoFT16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/biocas/KiyoyamaTGIUSNK16,
  author       = {Koji Kiyoyama and
                  Yoshiki Takezawa and
                  Tatsuya Goto and
                  Keita Ito and
                  Shoma Uno and
                  Kenji Shimokawa and
                  Satoru Nishino and
                  Hisashi Kino and
                  Tetsu Tanaka},
  title        = {Wide-range and precise tissue impedance analysis circuit with ultralow
                  current source using gate-induced drain-leakage current},
  booktitle    = {{IEEE} Biomedical Circuits and Systems Conference, BioCAS 2016, Shanghai,
                  China, October 17-19, 2016},
  pages        = {304--307},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/BioCAS.2016.7833792},
  doi          = {10.1109/BIOCAS.2016.7833792},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/biocas/KiyoyamaTGIUSNK16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/TanikawaKFKT15,
  author       = {Seiya Tanikawa and
                  Hisashi Kino and
                  Takafumi Fukushima and
                  Mitsumasa Koyanagi and
                  Tetsu Tanaka},
  title        = {Novel local stress evaluation method in 3D {IC} using {DRAM} cell
                  array with planar mOS capacitors},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS3.1.1--TS3.1.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334557},
  doi          = {10.1109/3DIC.2015.7334557},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/TanikawaKFKT15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/KinoHTSIFKT15,
  author       = {Hisashi Kino and
                  Hideto Hashiguchi and
                  Seiya Tanikawa and
                  Yohei Sugawara and
                  Shunsuke Ikegaya and
                  Takafumi Fukushima and
                  Mitsumasa Koyanagi and
                  Tetsu Tanaka},
  title        = {Consideration of microbump layout for reduction of local bending stress
                  due to {CTE} Mismatch in 3D {IC}},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS8.26.1--TS8.26.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334596},
  doi          = {10.1109/3DIC.2015.7334596},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KinoHTSIFKT15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/embc/KannoLHKKMYT13,
  author       = {Shota Kanno and
                  Sang{-}Rim Lee and
                  T. Harashima and
                  Toshinobu Kuki and
                  Hisashi Kino and
                  Hajime Mushiake and
                  Hongyi Yao and
                  Tetsu Tanaka},
  title        = {Multiple optical stimulation to neuron using Si opto-neural probe
                  with multiple optical waveguides and metal-cover for optogenetics},
  booktitle    = {35th Annual International Conference of the {IEEE} Engineering in
                  Medicine and Biology Society, {EMBC} 2013, Osaka, Japan, July 3-7,
                  2013},
  pages        = {253--256},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/EMBC.2013.6609485},
  doi          = {10.1109/EMBC.2013.6609485},
  timestamp    = {Sun, 31 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/embc/KannoLHKKMYT13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BeaMONKLFTK09,
  author       = {Ji Chel Bea and
                  Mariappan Murugesan and
                  Yuki Ohara and
                  Akihiro Noriki and
                  Hisashi Kino and
                  Kang Wook Lee and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement
                  of thinned silicon substrates for 3D integration},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306568},
  doi          = {10.1109/3DIC.2009.5306568},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/BeaMONKLFTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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