BibTeX records: Jichoel Bea

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@inproceedings{DBLP:conf/irps/MurugesanFBHK18,
  author    = {Mariappan Murugesan and
               Takafumi Fukushima and
               Ji Chel Bea and
               H. Hashimoto and
               Mitsu Koyanagi},
  title     = {Intra- and inter-chip electrical interconnection formed by directed
               self assembly of nanocomposite containing diblock copolymer and nanometal},
  booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
               CA, USA, March 11-15, 2018},
  pages     = {4},
  year      = {2018},
  crossref  = {DBLP:conf/irps/2018},
  url       = {https://doi.org/10.1109/IRPS.2018.8353589},
  doi       = {10.1109/IRPS.2018.8353589},
  timestamp = {Tue, 22 Jan 2019 16:39:11 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/irps/MurugesanFBHK18},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/micromachines/FukushimaHYKMBL16,
  author    = {Takafumi Fukushima and
               Hideto Hashiguchi and
               Hiroshi Yonekura and
               Hisashi Kino and
               Mariappan Murugesan and
               Ji Chel Bea and
               Kang Wook Lee and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary
               Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration},
  journal   = {Micromachines},
  volume    = {7},
  number    = {10},
  pages     = {184},
  year      = {2016},
  url       = {https://doi.org/10.3390/mi7100184},
  doi       = {10.3390/mi7100184},
  timestamp = {Tue, 14 Aug 2018 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/micromachines/FukushimaHYKMBL16},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaMOHBLT16,
  author    = {Takafumi Fukushima and
               Mariappan Murugesan and
               Shin Ohsaki and
               Hiroyuki Hashimoto and
               Jichoel Bea and
               Kang Wook Lee and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {New concept of {TSV} formation methodology using Directed Self-Assembly
               {(DSA)}},
  booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
               2016, San Francisco, CA, USA, November 8-11, 2016},
  pages     = {1--4},
  year      = {2016},
  crossref  = {DBLP:conf/3dic/2016},
  url       = {https://doi.org/10.1109/3DIC.2016.7970022},
  doi       = {10.1109/3DIC.2016.7970022},
  timestamp = {Thu, 13 Jul 2017 17:13:18 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaMOHBLT16},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeNBFRWTK16,
  author    = {Kang Wook Lee and
               Ai Nakamura and
               Jicheol Bea and
               Takafumi Fukushima and
               Suresh Ramalingam and
               Xin Wu and
               Tanaka Tanaka and
               Mitsumasa Koyanagi},
  title     = {Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar
               {(CNP)} for high yield exascale 2.5/3D integration applications},
  booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
               2016, San Francisco, CA, USA, November 8-11, 2016},
  pages     = {1--5},
  year      = {2016},
  crossref  = {DBLP:conf/3dic/2016},
  url       = {https://doi.org/10.1109/3DIC.2016.7970027},
  doi       = {10.1109/3DIC.2016.7970027},
  timestamp = {Thu, 13 Jul 2017 17:13:18 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeNBFRWTK16},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanBFMTK16,
  author    = {Mariappan Murugesan and
               Jichel Bea and
               Takafumi Fukushima and
               Makoto Motoyoshi and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed
               TiSix for via-last {TSV} technology},
  booktitle = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
               2016, San Francisco, CA, USA, November 8-11, 2016},
  pages     = {1--4},
  year      = {2016},
  crossref  = {DBLP:conf/3dic/2016},
  url       = {https://doi.org/10.1109/3DIC.2016.7970017},
  doi       = {10.1109/3DIC.2016.7970017},
  timestamp = {Thu, 13 Jul 2017 17:13:18 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanBFMTK16},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeBKFT15,
  author    = {K. W. Lee and
               Ji Chel Bea and
               Mitsu Koyanagi and
               Takafumi Fukushima and
               Tetsu Tanaka},
  title     = {Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku
               University},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {FS2.1--FS2.5},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334464},
  doi       = {10.1109/3DIC.2015.7334464},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeBKFT15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeNNABKHFT15,
  author    = {K. W. Lee and
               Chisato Nagai and
               Ai Nakamura and
               H. Aizawa and
               Ji Chel Bea and
               Mitsumasa Koyanagi and
               Hideto Hashiguchi and
               Takafumi Fukushima and
               Tanaka Tanaka},
  title     = {Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology
               for ultra-high density 3D integration using recessed oxide, thin glue
               adhesive, and thin metal capping layers},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {TS1.2.1--TS1.2.4},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334471},
  doi       = {10.1109/3DIC.2015.7334471},
  timestamp = {Thu, 13 Jul 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeNNABKHFT15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaSHNBHM15,
  author    = {Takafumi Fukushima and
               Taku Suzuki and
               Hideto Hashiguchi and
               Chisato Nagai and
               Jichoel Bea and
               Hiroyuki Hashimoto and
               Mariappan Murugesan and
               Kang Wook Lee and
               Tetsu Tanaka and
               Kazushi Asami and
               Yasuhiro Kitamura and
               Mitsumasa Koyanagi},
  title     = {Transfer and non-transfer stacking technologies based on chip-to-wafer
               self-asembly for high-throughput and high-precision alignment and
               microbump bonding},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {TS7.4.1--TS7.4.4},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334578},
  doi       = {10.1109/3DIC.2015.7334578},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaSHNBHM15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanBHLKFT15,
  author    = {Mariappan Murugesan and
               Jichoel Bea and
               H. Hashimoto and
               K. W. Lee and
               Mitsu Koyanagi and
               Takafumi Fukushima and
               Tetsu Tanaka},
  title     = {Mitigating thermo mechanical stress in high-density 3D-LSI through
               dielectric liners in Cu- through silicon Via {\_} {\(\mathrm{\mu}\)}-RS
               and {\(\mathrm{\mu}\)}-XRD study},
  booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  pages     = {TS8.10.1--TS8.10.5},
  year      = {2015},
  crossref  = {DBLP:conf/3dic/2015},
  url       = {https://doi.org/10.1109/3DIC.2015.7334579},
  doi       = {10.1109/3DIC.2015.7334579},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanBHLKFT15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/irps/LeeBMFTK15,
  author    = {Kang Wook Lee and
               Ji Chel Bea and
               Mariappan Murugesan and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Impacts of 3-D integration processes on device reliabilities in thinned
               {DRAM} chip for 3-D {DRAM}},
  booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
               CA, USA, April 19-23, 2015},
  pages     = {4},
  year      = {2015},
  crossref  = {DBLP:conf/irps/2015},
  url       = {https://doi.org/10.1109/IRPS.2015.7112733},
  doi       = {10.1109/IRPS.2015.7112733},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/irps/LeeBMFTK15},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaIMBLCT14,
  author    = {Takafumi Fukushima and
               Yuka Ito and
               Mariappan Murugesan and
               Jicheol Bea and
               Kang Wook Lee and
               Koji Choki and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Tiny {VCSEL} chip self-assembly for advanced chip-to-wafer 3D and
               hetero integration},
  booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
               Ireland, December 1-3, 2014},
  pages     = {1--4},
  year      = {2014},
  crossref  = {DBLP:conf/3dic/2014},
  url       = {https://doi.org/10.1109/3DIC.2014.7152145},
  doi       = {10.1109/3DIC.2014.7152145},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaIMBLCT14},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeNNBMFTK14,
  author    = {K. W. Lee and
               Chisato Nagai and
               Ai Nakamura and
               Ji Chel Bea and
               Mariappan Murugesan and
               Takafumi Fukushima and
               Tanaka Tanaka and
               Mitsumasa Koyanagi},
  title     = {Effects of electro-less Ni layer as barrier/seed layers for high reliable
               and low cost Cu {TSV}},
  booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
               Ireland, December 1-3, 2014},
  pages     = {1--4},
  year      = {2014},
  crossref  = {DBLP:conf/3dic/2014},
  url       = {https://doi.org/10.1109/3DIC.2014.7152153},
  doi       = {10.1109/3DIC.2014.7152153},
  timestamp = {Thu, 13 Jul 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeNNBMFTK14},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanFBLKIK14,
  author    = {Mariappan Murugesan and
               Takafumi Fukushima and
               Ji Chel Bea and
               K. W. Lee and
               Mitsu Koyanagi and
               Y. Imai and
               S. Kimura and
               Tetsu Tanaka},
  title     = {Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical
               stress in high-density 3D-LSI},
  booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
               Ireland, December 1-3, 2014},
  pages     = {1--4},
  year      = {2014},
  crossref  = {DBLP:conf/3dic/2014},
  url       = {https://doi.org/10.1109/3DIC.2014.7152158},
  doi       = {10.1109/3DIC.2014.7152158},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanFBLKIK14},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaBMLK13,
  author    = {Takafumi Fukushima and
               Jichoel Bea and
               Mariappan Murugesan and
               Kang Wook Lee and
               Mitsumasa Koyanagi},
  title     = {Development of via-last 3D integration technologies using a new temporary
               adhesive system},
  booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  pages     = {1--4},
  year      = {2013},
  crossref  = {DBLP:conf/3dic/2013},
  url       = {https://doi.org/10.1109/3DIC.2013.6702383},
  doi       = {10.1109/3DIC.2013.6702383},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaBMLK13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaBMSSBKLK13,
  author    = {Takafumi Fukushima and
               Jichoel Bea and
               Mariappan Murugesan and
               H.{-}Y. Son and
               M.{-}S. Suh and
               K.{-}Y. Byun and
               N.{-}S. Kim and
               Kang Wook Lee and
               Mitsumasa Koyanagi},
  title     = {3D memory chip stacking by multi-layer self-assembly technology},
  booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  pages     = {1--4},
  year      = {2013},
  crossref  = {DBLP:conf/3dic/2013},
  url       = {https://doi.org/10.1109/3DIC.2013.6702360},
  doi       = {10.1109/3DIC.2013.6702360},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaBMSSBKLK13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeTMNBFTK13,
  author    = {Kang Wook Lee and
               Seiya Tanikawa and
               Mariappan Murugesan and
               H. Naganuma and
               Jichoel Bea and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Impact of 3-D integration process on memory retention characteristics
               in thinned {DRAM} chip for 3-D memory},
  booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  pages     = {1--4},
  year      = {2013},
  crossref  = {DBLP:conf/3dic/2013},
  url       = {https://doi.org/10.1109/3DIC.2013.6702336},
  doi       = {10.1109/3DIC.2013.6702336},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeTMNBFTK13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanBLFTKSWK13,
  author    = {Mariappan Murugesan and
               Jichoel Bea and
               Kang Wook Lee and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi and
               Y. Sutou and
               H. Wang and
               J. Koike},
  title     = {Effect of {CVD} Mn oxide layer as Cu diffusion barrier for {TSV}},
  booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  pages     = {1--4},
  year      = {2013},
  crossref  = {DBLP:conf/3dic/2013},
  url       = {https://doi.org/10.1109/3DIC.2013.6702364},
  doi       = {10.1109/3DIC.2013.6702364},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanBLFTKSWK13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/micromachines/FukushimaKIKKMBLTK11,
  author    = {Takafumi Fukushima and
               Takayuki Konno and
               Eiji Iwata and
               Risato Kobayashi and
               Toshiya Kojima and
               Mariappan Murugesan and
               Ji Chel Bea and
               Kang Wook Lee and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision
               Alignment and Direct Bonding without Thermal Compression for Hetero
               Integration},
  journal   = {Micromachines},
  volume    = {2},
  number    = {1},
  pages     = {49--68},
  year      = {2011},
  url       = {https://doi.org/10.3390/mi2010049},
  doi       = {10.3390/mi2010049},
  timestamp = {Tue, 14 Aug 2018 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/micromachines/FukushimaKIKKMBLTK11},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaOBMLTK11,
  author    = {Takafumi Fukushima and
               Yuki Ohara and
               Jichoel Bea and
               Mariappan Murugesan and
               Kang Wook Lee and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Temporary bonding strength control for self-assembly-based 3D integration},
  booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
               Osaka, Japan, January 31 - February 2, 2012},
  pages     = {1--4},
  year      = {2011},
  crossref  = {DBLP:conf/3dic/2011},
  url       = {https://doi.org/10.1109/3DIC.2012.6262954},
  doi       = {10.1109/3DIC.2012.6262954},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaOBMLTK11},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeBFOTK11,
  author    = {Kang Wook Lee and
               Jichoel Bea and
               Takafumi Fukushima and
               Yuki Ohara and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {High reliable and fine size of 5-{\(\mu\)}m diameter backside Cu through-silicon
               Via(TSV) for high reliability and high-end 3-D LSIs},
  booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
               Osaka, Japan, January 31 - February 2, 2012},
  pages     = {1--4},
  year      = {2011},
  crossref  = {DBLP:conf/3dic/2011},
  url       = {https://doi.org/10.1109/3DIC.2012.6262975},
  doi       = {10.1109/3DIC.2012.6262975},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeBFOTK11},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NorikiLBFFK11,
  author    = {Akihiro Noriki and
               Kang Wook Lee and
               Jichoel Bea and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Fabrication tolerance evaluation of high efficient unidirectional
               optical coupler for though silicon photonic via in optoelectronic
               3D-LSI},
  booktitle = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
               Osaka, Japan, January 31 - February 2, 2012},
  pages     = {1--4},
  year      = {2011},
  crossref  = {DBLP:conf/3dic/2011},
  url       = {https://doi.org/10.1109/3DIC.2012.6262957},
  doi       = {10.1109/3DIC.2012.6262957},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/NorikiLBFFK11},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/FukushimaIBMLTK10,
  author    = {Takafumi Fukushima and
               Eiji Iwata and
               Jichoel Bea and
               Mariappan Murugesan and
               Kang Wook Lee and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Evaluation of alignment accuracy on chip-to-wafer self-assembly and
               mechanism on the direct chip bonding at room temperature},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
               Munich, Germany, 16-18 November 2010},
  pages     = {1--5},
  year      = {2010},
  crossref  = {DBLP:conf/3dic/2010},
  url       = {https://doi.org/10.1109/3DIC.2010.5751436},
  doi       = {10.1109/3DIC.2010.5751436},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/FukushimaIBMLTK10},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/MurugesanOBLFTK10,
  author    = {Mariappan Murugesan and
               Yuki Ohara and
               Jichoel Bea and
               Kang Wook Lee and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Impact of microbump induced stress in thinned 3D-LSIs after wafer
               bonding},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
               Munich, Germany, 16-18 November 2010},
  pages     = {1--5},
  year      = {2010},
  crossref  = {DBLP:conf/3dic/2010},
  url       = {https://doi.org/10.1109/3DIC.2010.5751432},
  doi       = {10.1109/3DIC.2010.5751432},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/MurugesanOBLFTK10},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/NorikiLBFTK10,
  author    = {Akihiro Noriki and
               Kang Wook Lee and
               Jichoel Bea and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Through Silicon photonic via {(TSPV)} with Si core for low loss and
               high-speed data transmission in opto-electronic 3-D {LSI}},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
               Munich, Germany, 16-18 November 2010},
  pages     = {1--4},
  year      = {2010},
  crossref  = {DBLP:conf/3dic/2010},
  url       = {https://doi.org/10.1109/3DIC.2010.5751435},
  doi       = {10.1109/3DIC.2010.5751435},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/NorikiLBFTK10},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/BeaMONKLFTK09,
  author    = {Ji Chel Bea and
               Mariappan Murugesan and
               Yuki Ohara and
               Akihiro Noriki and
               Hisashi Kino and
               Kang Wook Lee and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement
               of thinned silicon substrates for 3D integration},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--5},
  year      = {2009},
  crossref  = {DBLP:conf/3dic/2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306568},
  doi       = {10.1109/3DIC.2009.5306568},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/BeaMONKLFTK09},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/LeeKOKBFTK09,
  author    = {Kang Wook Lee and
               Shigeyuki Kanno and
               Yuki Ohara and
               Kouji Kiyoyama and
               Ji Chel Bea and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {Heterogeneous integration technology for {MEMS-LSI} multi-chip module},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--6},
  year      = {2009},
  crossref  = {DBLP:conf/3dic/2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306599},
  doi       = {10.1109/3DIC.2009.5306599},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/LeeKOKBFTK09},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/3dic/OharaNSLMBYFTK09,
  author    = {Yuki Ohara and
               Akihiro Noriki and
               Katsuyuki Sakuma and
               Kang Wook Lee and
               Mariappan Murugesan and
               Jichoel Bea and
               Fumiaki Yamada and
               Takafumi Fukushima and
               Tetsu Tanaka and
               Mitsumasa Koyanagi},
  title     = {10 {\(\mathrm{\mu}\)}m fine pitch Cu/Sn micro-bumps for 3-D super-chip
               stack},
  booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  pages     = {1--6},
  year      = {2009},
  crossref  = {DBLP:conf/3dic/2009},
  url       = {https://doi.org/10.1109/3DIC.2009.5306532},
  doi       = {10.1109/3DIC.2009.5306532},
  timestamp = {Sun, 21 May 2017 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/OharaNSLMBYFTK09},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/irps/2018,
  title     = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
               CA, USA, March 11-15, 2018},
  publisher = {{IEEE}},
  year      = {2018},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=8345372},
  isbn      = {978-1-5386-5479-8},
  timestamp = {Tue, 22 Jan 2019 16:39:11 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/irps/2018},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2016,
  title     = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
               2016, San Francisco, CA, USA, November 8-11, 2016},
  publisher = {{IEEE}},
  year      = {2016},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7959775},
  isbn      = {978-1-5090-1399-9},
  timestamp = {Thu, 13 Jul 2017 17:13:18 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2016},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2015,
  title     = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
               Japan, August 31 - September 2, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7328029},
  isbn      = {978-1-4673-9385-0},
  timestamp = {Thu, 26 Nov 2015 10:04:17 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/irps/2015,
  title     = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
               CA, USA, April 19-23, 2015},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7106273},
  isbn      = {978-1-4673-7362-3},
  timestamp = {Mon, 07 Mar 2016 09:32:18 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/irps/2015},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2014,
  title     = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
               Ireland, December 1-3, 2014},
  publisher = {{IEEE}},
  year      = {2014},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=7147632},
  isbn      = {978-1-4799-8472-5},
  timestamp = {Wed, 15 Jul 2015 09:40:08 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2014},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2013,
  title     = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
               San Francisco, CA, USA, October 2-4, 2013},
  publisher = {{IEEE}},
  year      = {2013},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6690582},
  isbn      = {978-1-4673-6484-3},
  timestamp = {Mon, 26 Nov 2018 17:05:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2013},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2011,
  editor    = {Mitsumasa Koyanagi and
               Morihiro Kada},
  title     = {2011 {IEEE} International 3D Systems Integration Conference (3DIC),
               Osaka, Japan, January 31 - February 2, 2012},
  publisher = {{IEEE}},
  year      = {2012},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6253019},
  isbn      = {978-1-4673-2189-1},
  timestamp = {Wed, 05 Sep 2012 18:40:30 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2011},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2010,
  title     = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
               Munich, Germany, 16-18 November 2010},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5742028},
  isbn      = {978-1-4577-0526-7},
  timestamp = {Wed, 25 Nov 2015 15:22:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2010},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/3dic/2009,
  title     = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
               San Francisco, California, USA, 28-30 September 2009},
  publisher = {{IEEE}},
  year      = {2009},
  url       = {http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5290624},
  isbn      = {978-1-4244-4511-0},
  timestamp = {Wed, 25 Nov 2015 15:22:49 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/3dic/2009},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
maintained by Schloss Dagstuhl LZI, founded at University of Trier