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ORCIDMicroelectronics Reliability, Volume 65
Volume 65, October 2016
- Elviz George, Michael G. Pecht:
RoHS compliance in safety and reliability critical electronics. 1-7 - Junxing Li, Zhihua Wang
, Xia Liu, Yongbo Zhang, Huimin Fu, Chengrui Liu:
A Wiener process model for accelerated degradation analysis considering measurement errors. 8-15 - Segeun Park, Hyuckchai Jung, Jeonghoon Oh, Ilgweon Kim, Hyoungsun Hong, Gyoyoung Jin, Yonghan Roh:
Off-state degradation with ac bias in PMOSFET. 16-19 - Kolsoom Mehrabi, Behzad Ebrahimi, Roohollah Yarmand, Ali Afzali-Kusha, Hamid Mahmoodi:
Read static noise margin aging model considering SBD and BTI effects for FinFET SRAMs. 20-26 - Maran Ponnambalam, N. Vinodhkumar, R. Srinivasan, Premanand Venkatesh Chandramani:
Phase displacement study in MOSFET based ring VCOs due to heavy-ion irradiation using 3D-TCAD and circuit simulation. 27-34 - Xueyang Li, Gang Xie, Cen Tang, Kuang Sheng:
Charge trapping related channel modulation instability in P-GaN gate HEMTs. 35-40 - Yabin Sun, Jun Fu, Yudong Wang, Wei Zhou, Zhihong Liu, Xiaojin Li, Yanling Shi:
Experimental study of bias dependence of pulsed laser-induced single-event transient in SiGe HBT. 41-46 - Sayani Ghosh, Kalyan Koley, Chandan Kumar Sarkar:
Study of process induced variability of germanium-pTFET in analog and RF domain. 47-54 - A. V. Gradoboev, K. N. Orlova, I. A. Asanov, A. V. Simonova:
The fast neutron irradiation influence on the AlGaAs IR-LEDs reliability. 55-59 - Hong-Zhi Lin, Yow-Jon Lin:
Electrical conduction mechanisms in the temperature-dependent current-voltage characteristics of poly(3-hexylthiophene)/n-type Si devices. 60-63 - R. P. Shi, X. D. Huang, Johnny K. O. Sin, Pui-To Lai:
Nb-doped Ga2O3 as charge-trapping layer for nonvolatile memory applications. 64-68 - Xiong Du, Jun Zhang, Gaoxian Li, Heng-Ming Tai, Pengju Sun, Luowei Zhou:
Lifetime estimation for IGBT modules in wind turbine power converter system considering ambient temperature. 69-78 - Haithem Skima, Kamal Medjaher, Christophe Varnier, Eugen Dedu, Julien Bourgeois:
A hybrid prognostics approach for MEMS: From real measurements to remaining useful life estimation. 79-88 - Jamal Abdul-Kareem Mohammed:
Economical design of H-bridge multilevel inverter drive controlled by modified fast algorithm. 89-97 - Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan:
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate. 98-107 - Wiyao Kpobie, Marion Martiny, Sebastien Mercier, François Lechleiter, Laurent Bodin, Aurélien Lecavelier des Etangs-Levallois, M. Brizoux:
Thermo-mechanical simulation of PCB with embedded components. 108-130 - De-Shau Huang, Wen-Bin Tu, Xiu-Ming Zhang, Liang-Te Tsai, Ti-Yuan Wu, Ming-Tzer Lin:
Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. 131-141 - Sami Myllymäki, Jussi Putaala, Jari Hannu, Esa Kunnari, Matti Mäntysalo:
RF measurements to pinpoint defects in inkjet-printed, thermally and mechanically stressed coplanar waveguides. 142-150 - Sang Min Yang, Yo Seb Lee, Yonghee Jang, Doyoung Byun, Sung-Hoon Choa:
Electromechanical reliability of a flexible metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing. 151-159 - K. J. Wong, K. O. Low, H. A. Israr, M. N. Tamin:
Thickness-dependent non-Fickian moisture absorption in epoxy molding compounds. 160-166 - K.-C. Wu, Kuo-Ning Chiang:
Characterization on acceleration-factor equation for packaging-solder joint reliability. 167-172 - Xuan Wang, C. Key Chung:
Mechanisms and solutions to the brittle solder joint in electroless Ni plating. 173-177 - Yuan Li, Hsin-Tzu Lee, Masumi Saka:
Influence of local thermal dissipation on electromigration in an Al thin-film line. 178-183 - Chee Kuang Kok, Wen Jie Ng, Chin Chin Ooi, Kia Wai Liew:
Ball-grid-array solder joint model for assembly-level impact reliability prediction. 184-191 - Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu:
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. 192-197 - Lin Lin, Jun Wang, Lei Wang, Wenqi Zhang:
The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process. 198-204 - Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas:
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. 205-216 - Brett Fennell, Sangil Lee, Daniel F. Baldwin:
Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid. 217-224 - Fan Bu, Qing Ma, Zheyao Wang:
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride. 225-233 - Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park:
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. 234-242 - Van Nhat Le, Lahouari Benabou, Victor Etgens, Quang Bang Tao:
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling. 243-254 - M. I. I. Ramli, N. Saud, M. A. A. Mohd Salleh, Mohd Nazree Derman, R. Mohd Said:
Effect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder. 255-264 - Yapeng Zhou, Miaohua Huang:
Lithium-ion batteries remaining useful life prediction based on a mixture of empirical mode decomposition and ARIMA model. 265-273 - Sijie Cheng, Bimei Li, Zhongzhi Yuan, Fuyi Zhang, Jincheng Liu:
Development of a lifetime prediction model for lithium thionyl chloride batteries based on an accelerated degradation test. 274-279 - Bartomeu Alorda, Cristian Carmona, Gabriel Torrens, Sebastià A. Bota:
An affordable experimental technique for SRAM write margin characterization for nanometer CMOS technologies. 280-288 - Goran S. Nikolic, Mile K. Stojcev, Tatjana R. Nikolic, Branislav D. Petrovic, Goran S. Jovanovic:
Reliable data transfer Rendezvous protocol in wireless sensor networks using 2D-SEC-DED encoding technique. 289-309 - Alina Caddemi, Emanuele Cardillo, Giuseppe Salvo, Salvatore Patanè:
Microwave effects of UV light exposure of a GaN HEMT: Measurements and model extraction. 310-317 - Ee-Hua Wong, S. B. Park:
Moisture diffusion modeling - A critical review. 318-326 - Chong Leong Gan, Uda Hashim:
3D Flash Memories. 327-328
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