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ORCID31st Hot Chips Symposium 2019: Cupertino, CA, USA
- 2019 IEEE Hot Chips 31 Symposium (HCS), Cupertino, CA, USA, August 18-20, 2019. IEEE 2019, ISBN 978-1-7281-2089-8
- Hongyang Jia, Hossein Valavi, Yinqi Tang, Jintao Zhang, Naveen Verma:
A Programmable Embedded Microprocessor for Bit-scalable In-memory Computing. 1-29 - Sagheer Ahmad, Sridhar Subramanian, Vamsi Boppana, Shankar Lakka, Fu-Hing Ho, Tomai Knopp, Juanjo Noguera, Gaurav Singh, Ralph Wittig:
Xilinx First 7nm Device: Versal AI Core (VC1902). 1-28 - Andrea Pellegrini, Chris Abernathy:
Arm Neoverse N1 Cloud-to-Edge Infrastructure SoCs. 1-21 - Sanjeev Khushu, Wilfred Gomes:
Lakefield: Hybrid cores in 3D Package. 1-20 - Andrew Yang:
Deep Learning Training At Scale Spring Crest Deep Learning Accelerator (Intel® Nervana™ NNP-T). 1-20 - Pete Bannon, Ganesh Venkataramanan, Debjit Das Sarma, Emil Talpes:
Computer and Redundancy Solution for the Full Self-Driving Computer. 1-22 - Patrick Knebel, Dan Berkram, Al Davis, Darel Emmot, Paolo Faraboschi, Gary Gostin:
Gen-Z Chipsetfor Exascale Fabrics. 1-22 - Mike Mantor:
7NM "NAVI" GPU - A GPU Built for Performance and Efficiency. 1-28 - Misha Smelyanskiy:
Zion: Facebook Next- Generation Large Memory Training Platform. 1-22 - John Burgess:
RTX ON - The NVIDIA TURING GPU. 1-27 - Heng Liao, Jiajin Tu, Jing Xia, Xiping Zhou:
DaVinci: A Scalable Architecture for Neural Network Computing. 1-44 - Rangharajan Venkatesan, Yakun Sophia Shao, Brian Zimmer, Jason Clemons
, Matthew Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, Nathaniel Ross Pinckney, Priyanka Raina, Stephen G. Tell, Yanqing Zhang, William J. Dally, Joel S. Emer, C. Thomas Gray, Stephen W. Keckler, Brucek Khailany:
A 0.11 PJ/OP, 0.32-128 Tops, Scalable Multi-Chip-Module-Based Deep Neural Network Accelerator Designed with A High-Productivity vlsi Methodology. 1-24 - Mark Wade:
TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth in-Package Optical I/O. i-xl - Peter Mattson:
ML Benchmark Design Challenges. 1-36 - Jeff Stuecheli, Scott Willenborg, William J. Starke:
IBM's Next Generation POWER Processor. 1-19 - Jiansong Zhang, Lixue Xia, Zhao Jiang, Hao Liang, Jiaoyan Chen, Shouda Liu, Wei Lin, Yuan Xie:
Ouroboros: An Inference Engine for Deep Learning Based TTS on Embedded Devices. 1-28 - Elene Terry:
Silicon at the Heart of HoloLens 2. 1-26 - Eitan Medina:
Hot Chips 2019. 1-29 - Ofri Wechsler, Michael Behar, Bharat Daga:
Spring Hill (NNP-I 1000) Intel's Data Center Inference Chip. 1-12 - David Suggs, Dan Bouvier, Michael Clark, Kevin Lepak, Mahesh Subramony:
AMD "ZEN 2". 1-24 - Fabrice Devaux:
The true Processing In Memory accelerator. 1-24 - Kamesh Medepalli:
CYW89459: High Performance and Low Power Wi-Fi and Bluetooth 5.1 Combo Chip for IoT and Automotive. 1-18 - Leibo Liu, Ao Luo, Guanhua Li, Jianfeng Zhu, Yong Wang, Gang Shan, Jianfeng Pan, Shouyi Yin, Shaojun Wei:
Jintide®: A Hardware Security Enhanced Server CPU with Xeon® Cores under Runtime Surveillance by an In-Package Dynamically Reconfigurable Processor. 1-25 - Lisa Su:
Delivering the Future of High-Performance Computing. 1-43 - H.-S. Philip Wong:
IC Technology - What Will the Next Node Offer Us? 1-52
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