BibTeX record journals/pieee/ColomboPP09

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@article{DBLP:journals/pieee/ColomboPP09,
  author       = {Luigi Pietro Maria Colombo and
                  Davide Paleari and
                  Alexey Petrushin},
  title        = {A Model of {BGA} Thermal Vias as an Example of Lumped Parameter Analysis
                  in Thermal Modeling of SiPs and Stacked Die Packages},
  journal      = {Proc. {IEEE}},
  volume       = {97},
  number       = {1},
  pages        = {70--77},
  year         = {2009},
  url          = {https://doi.org/10.1109/JPROC.2008.2007466},
  doi          = {10.1109/JPROC.2008.2007466},
  timestamp    = {Fri, 02 Oct 2020 14:42:00 +0200},
  biburl       = {https://dblp.org/rec/journals/pieee/ColomboPP09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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