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BibTeX record journals/mr/HochstenbachDYZB10
@article{DBLP:journals/mr/HochstenbachDYZB10, author = {Hendrik Pieter Hochstenbach and Willem D. van Driel and Dao{-}Guo Yang and Jeroen J. M. Zaal and E. Bagerman}, title = {Designing for reliability using a new Wafer Level Package structure}, journal = {Microelectron. Reliab.}, volume = {50}, number = {4}, pages = {528--535}, year = {2010}, url = {https://doi.org/10.1016/j.microrel.2009.09.011}, doi = {10.1016/J.MICROREL.2009.09.011}, timestamp = {Sat, 22 Feb 2020 19:26:49 +0100}, biburl = {https://dblp.org/rec/journals/mr/HochstenbachDYZB10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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