BibTeX record conf/iscas/FengSH17

download as .bib file

@inproceedings{DBLP:conf/iscas/FengSH17,
  author       = {Tianming Feng and
                  Jebreel M. Salem and
                  Dong Sam Ha},
  title        = {High temperature {VCO} based on GaN devices for downhole communications},
  booktitle    = {{IEEE} International Symposium on Circuits and Systems, {ISCAS} 2017,
                  Baltimore, MD, USA, May 28-31, 2017},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2017},
  url          = {https://doi.org/10.1109/ISCAS.2017.8050448},
  doi          = {10.1109/ISCAS.2017.8050448},
  timestamp    = {Fri, 19 Feb 2021 11:42:52 +0100},
  biburl       = {https://dblp.org/rec/conf/iscas/FengSH17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.