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BibTeX record conf/irps/LinO15
@inproceedings{DBLP:conf/irps/LinO15, author = {M. H. Lin and A. S. Oates}, title = {Mechanisms of electromigration under {AC} and pulsed-DC stress in Cu/low-k dual damascene interconnects}, booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey, CA, USA, April 19-23, 2015}, pages = {2}, publisher = {{IEEE}}, year = {2015}, url = {https://doi.org/10.1109/IRPS.2015.7112681}, doi = {10.1109/IRPS.2015.7112681}, timestamp = {Wed, 16 Oct 2019 14:14:55 +0200}, biburl = {https://dblp.org/rec/conf/irps/LinO15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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