BibTeX record conf/3dic/OharaNSLMBYFTK09

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@inproceedings{DBLP:conf/3dic/OharaNSLMBYFTK09,
  author       = {Yuki Ohara and
                  Akihiro Noriki and
                  Katsuyuki Sakuma and
                  Kang Wook Lee and
                  Mariappan Murugesan and
                  Jichoel Bea and
                  Fumiaki Yamada and
                  Takafumi Fukushima and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {10 {\(\mathrm{\mu}\)}m fine pitch Cu/Sn micro-bumps for 3-D super-chip
                  stack},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306532},
  doi          = {10.1109/3DIC.2009.5306532},
  timestamp    = {Tue, 16 Feb 2021 15:53:52 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/OharaNSLMBYFTK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}