BibTeX record conf/3dic/LeeNBFRWTK16

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@inproceedings{DBLP:conf/3dic/LeeNBFRWTK16,
  author       = {Kang Wook Lee and
                  Ai Nakamura and
                  Jicheol Bea and
                  Takafumi Fukushima and
                  Suresh Ramalingam and
                  Xin Wu and
                  Tanaka Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar
                  {(CNP)} for high yield exascale 2.5/3D integration applications},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970027},
  doi          = {10.1109/3DIC.2016.7970027},
  timestamp    = {Tue, 16 Feb 2021 15:53:52 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/LeeNBFRWTK16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}