BibTeX record conf/3dic/FukushimaSHNBHM15

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@inproceedings{DBLP:conf/3dic/FukushimaSHNBHM15,
  author       = {Takafumi Fukushima and
                  Taku Suzuki and
                  Hideto Hashiguchi and
                  Chisato Nagai and
                  Jichoel Bea and
                  Hiroyuki Hashimoto and
                  Mariappan Murugesan and
                  Kang Wook Lee and
                  Tetsu Tanaka and
                  Kazushi Asami and
                  Yasuhiro Kitamura and
                  Mitsumasa Koyanagi},
  title        = {Transfer and non-transfer stacking technologies based on chip-to-wafer
                  self-asembly for high-throughput and high-precision alignment and
                  microbump bonding},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS7.4.1--TS7.4.4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334578},
  doi          = {10.1109/3DIC.2015.7334578},
  timestamp    = {Tue, 16 Feb 2021 15:53:52 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FukushimaSHNBHM15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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