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BibTeX record conf/3dic/FukushimaSHNBHM15
@inproceedings{DBLP:conf/3dic/FukushimaSHNBHM15, author = {Takafumi Fukushima and Taku Suzuki and Hideto Hashiguchi and Chisato Nagai and Jichoel Bea and Hiroyuki Hashimoto and Mariappan Murugesan and Kang Wook Lee and Tetsu Tanaka and Kazushi Asami and Yasuhiro Kitamura and Mitsumasa Koyanagi}, title = {Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding}, booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015}, pages = {TS7.4.1--TS7.4.4}, publisher = {{IEEE}}, year = {2015}, url = {https://doi.org/10.1109/3DIC.2015.7334578}, doi = {10.1109/3DIC.2015.7334578}, timestamp = {Tue, 16 Feb 2021 15:53:52 +0100}, biburl = {https://dblp.org/rec/conf/3dic/FukushimaSHNBHM15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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