BibTeX record conf/3dic/FukushimaIBMLTK10

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@inproceedings{DBLP:conf/3dic/FukushimaIBMLTK10,
  author       = {Takafumi Fukushima and
                  Eiji Iwata and
                  Jichoel Bea and
                  Mariappan Murugesan and
                  Kang Wook Lee and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi},
  title        = {Evaluation of alignment accuracy on chip-to-wafer self-assembly and
                  mechanism on the direct chip bonding at room temperature},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751436},
  doi          = {10.1109/3DIC.2010.5751436},
  timestamp    = {Tue, 16 Feb 2021 15:53:52 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FukushimaIBMLTK10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}