Anton Daanen

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Hamid Bonakdar

> Home > Persons > Anton Daanen

Publications

2006
[j3]
- view
  authority control:
- export record
  dblp key:
  - journals/jssc/CharlonLVDCJLHK06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jssc/CharlonLVDCJLHK06
Olivier Charlon, Matthias Locher, Hendrik Arend (Henk) Visser, David Duperray, Jennie Chen, Marc Judson, Alan L. Landesman, C. Hritz, Ulrich Kohlschuetter, Yifeng Zhang, C. Ramesh, Anton Daanen, Minzhan Gao, S. Haas, Vijay Maheshwari, Andreas Bury, Gunnar Nitsche, Artur Wrzyszcz, William Redman-White, Hamid Bonakdar, Rachid El Waffaoui, Mark Bracey:
A low-power high-performance SiGe BiCMOS 802.11a/b/g transceiver IC for cellular and bluetooth Co-existence applications. IEEE J. Solid State Circuits 41(7): 1503-1512 (2006)
2005
[c1]
- view
  authority control:
- export record
  dblp key:
  - conf/esscirc/CharlonLVDCJLHKZRDGHMBNWRBWB05
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/esscirc/CharlonLVDCJLHKZRDGHMBNWRBWB05
Olivier Charlon, Matthias Locher, Henk Visser, David Duperray, J. Cherr, Marc Judson, Alan L. Landesman, C. Hritz, Ulrich Kohlschuetter, Yifeng Zhang, C. Ramesh, Anton Daanen, Minzhan Gao, S. Haas, Vijay Maheshwari, Andreas Bury, Gunnar Nitsche, Artur Wrzyszcz, William Redman-White, Hamid Bonakdar, Rachid El Waffaoui, Mark Bracey:
A low-power high-performance SiGe BiCMOS 802.11a/b/g transceiver IC for cellular and Bluetooth co-existence applications. ESSCIRC 2005: 129-132

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.