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BibTeX records: R. L. J. M. Ubachs
@article{DBLP:journals/mr/Ubachs10, author = {R. L. J. M. Ubachs}, title = {Electromigration in {WLCSP} solder bumps}, journal = {Microelectron. Reliab.}, volume = {50}, number = {9-11}, pages = {1678--1683}, year = {2010}, url = {https://doi.org/10.1016/j.microrel.2010.07.069}, doi = {10.1016/J.MICROREL.2010.07.069}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/Ubachs10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/UbachsSDZ06, author = {R. L. J. M. Ubachs and Olaf van der Sluis and W. D. van Driel and G. Q. Zhang}, title = {Multiscale modelling of multilayer substrates}, journal = {Microelectron. Reliab.}, volume = {46}, number = {9-11}, pages = {1472--1477}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2006.07.013}, doi = {10.1016/J.MICROREL.2006.07.013}, timestamp = {Sat, 30 Sep 2023 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/UbachsSDZ06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/DrielSYUZAZ06, author = {W. D. van Driel and Olaf van der Sluis and Dao{-}Guo Yang and R. L. J. M. Ubachs and C. Zenz and G. Aflenzer and G. Q. Zhang}, title = {Reliability modelling for packages in flexible end-products}, journal = {Microelectron. Reliab.}, volume = {46}, number = {9-11}, pages = {1880--1885}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2006.07.085}, doi = {10.1016/J.MICROREL.2006.07.085}, timestamp = {Sat, 30 Sep 2023 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/DrielSYUZAZ06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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