BibTeX records: John Slabbekoorn

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@inproceedings{DBLP:conf/vlsit/PeetersSSDGSBPW22,
  author       = {Micha{\"{e}}l Peeters and
                  S. Sinha and
                  Xiao Sun and
                  Claude Desset and
                  Giuseppe Gramegna and
                  John Slabbekoorn and
                  Pieter Bex and
                  N. Pinho and
                  Tomas Webers and
                  Dimitrios Velenis and
                  A. Miller and
                  Nadine Collaert and
                  Geert Van der Plas and
                  Eric Beyne and
                  M. Huynen and
                  R. Broucke},
  title        = {(Why do we need) Wireless Heterogeneous Integration (anyway?)},
  booktitle    = {{IEEE} Symposium on {VLSI} Technology and Circuits {(VLSI} Technology
                  and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022},
  pages        = {256--257},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/VLSITechnologyandCir46769.2022.9830480},
  doi          = {10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830480},
  timestamp    = {Thu, 27 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/vlsit/PeetersSSDGSBPW22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/DerakhshandehHP16,
  author       = {Jaber Derakhshandeh and
                  Lin Hou and
                  Inge De Preter and
                  Carine Gerets and
                  Samuel Suhard and
                  Vikas Dubey and
                  Geraldine Jamieson and
                  Fumihiro Inoue and
                  Tomas Webers and
                  Pieter Bex and
                  Giovanni Capuz and
                  Eric Beyne and
                  John Slabbekoorn and
                  Teng Wang and
                  Anne Jourdain and
                  Gerald Beyer and
                  Kenneth June Rebibis and
                  Andy Miller},
  title        = {Die to wafer 3D stacking for below 10um pitch microbumps},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7969993},
  doi          = {10.1109/3DIC.2016.7969993},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/DerakhshandehHP16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}