BibTeX records: Dae-Hoon Na

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@inproceedings{DBLP:conf/vlsit/JoKKCPLSYPKLSKL23,
  author       = {Youngmin Jo and
                  Anil Kavala and
                  Tongsung Kim and
                  Byung{-}Kwan Chun and
                  Jungjune Park and
                  Taesung Lee and
                  Jungmin Seo and
                  Manjae Yang and
                  Taehyeon Park and
                  Hyunjin Kwon and
                  Cheolhui Lee and
                  Younghoon Son and
                  Junghwan Kwak and
                  Younggyu Lee and
                  Hwan{-}Seok Ku and
                  Dae{-}Hoon Na and
                  Changyeon Yu and
                  Jonghoon Park and
                  Jae{-}Hwan Kim and
                  Hyojin Kwon and
                  Chan{-}ho Kim and
                  Moon{-}Ki Jung and
                  Chanjin Park and
                  Donghyun Seo and
                  Moosung Kim and
                  Seungjae Lee and
                  Jin{-}Yub Lee and
                  Dongku Kang and
                  Chiweon Yoon and
                  SungHoi Hur},
  title        = {A 3.0 Gb/s/pin 4\({}^{\mbox{th}}\) generation F-chip with Toggle 5.0
                  Specification for 16Tb {NAND} Flash Memory Multi chip Package},
  booktitle    = {2023 {IEEE} Symposium on {VLSI} Technology and Circuits {(VLSI} Technology
                  and Circuits), Kyoto, Japan, June 11-16, 2023},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185391},
  doi          = {10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185391},
  timestamp    = {Fri, 28 Jul 2023 10:40:41 +0200},
  biburl       = {https://dblp.org/rec/conf/vlsit/JoKKCPLSYPKLSKL23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/isscc/KimYPPLKNCSLYLJ22,
  author       = {Moosung Kim and
                  Sung{-}Won Yun and
                  Jungjune Park and
                  Hyun Kook Park and
                  Jungyu Lee and
                  Yeong Seon Kim and
                  Dae{-}Hoon Na and
                  Sara Choi and
                  Youngsun Song and
                  Jonghoon Lee and
                  Hyun{-}Jun Yoon and
                  Kangbin Lee and
                  Byunghoon Jeong and
                  Sanglok Kim and
                  Junhong Park and
                  Cheon An Lee and
                  Jaeyun Lee and
                  Ji{-}Sang Lee and
                  Jin Young Chun and
                  Joonsuc Jang and
                  Younghwi Yang and
                  Seung Hyun Moon and
                  Myung{-}Hoon Choi and
                  Wontae Kim and
                  Jungsoo Kim and
                  Seok{-}Min Yoon and
                  Pansuk Kwak and
                  Myunghun Lee and
                  Raehyun Song and
                  Sunghoon Kim and
                  Chiweon Yoon and
                  Dongku Kang and
                  Jin{-}Yub Lee and
                  Jai Hyuk Song},
  title        = {A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write
                  Throughput and a 2.4Gb/s Interface},
  booktitle    = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2022,
                  San Francisco, CA, USA, February 20-26, 2022},
  pages        = {136--137},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/ISSCC42614.2022.9731640},
  doi          = {10.1109/ISSCC42614.2022.9731640},
  timestamp    = {Wed, 23 Mar 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/isscc/KimYPPLKNCSLYLJ22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/jssc/NaLLCLYSKKJJSCL21,
  author       = {Dae{-}Hoon Na and
                  Jang{-}Woo Lee and
                  Seon{-}Kyoo Lee and
                  Hwasuk Cho and
                  Junha Lee and
                  Manjae Yang and
                  Eunjin Song and
                  Anil Kavala and
                  Tongsung Kim and
                  Dong{-}Su Jang and
                  Youngmin Jo and
                  Ji{-}Yeon Shin and
                  Byung{-}Kwan Chun and
                  Tae{-}Sung Lee and
                  Byunghoon Jeong and
                  Chiweon Yoon and
                  Dongku Kang and
                  Seungjae Lee and
                  Jungdon Ihm and
                  Dae{-}Seok Byeon and
                  Jinyub Lee and
                  Jai Hyuk Song},
  title        = {A 1.8-Gb/s/Pin 16-Tb {NAND} Flash Memory Multi-Chip Package With F-Chip
                  for High-Performance and High-Capacity Storage},
  journal      = {{IEEE} J. Solid State Circuits},
  volume       = {56},
  number       = {4},
  pages        = {1129--1140},
  year         = {2021},
  url          = {https://doi.org/10.1109/JSSC.2021.3052492},
  doi          = {10.1109/JSSC.2021.3052492},
  timestamp    = {Wed, 04 Oct 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/jssc/NaLLCLYSKKJJSCL21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/vlsic/LeeNKCLYSKLJCJJ20,
  author       = {Jang{-}Woo Lee and
                  Dae{-}Hoon Na and
                  Anil Kavala and
                  Hwasuk Cho and
                  Junha Lee and
                  Manjae Yang and
                  Eunjin Song and
                  Tongsung Kim and
                  Seon{-}Kyoo Lee and
                  Dong{-}Su Jang and
                  Byung{-}Kwan Chun and
                  Youngmin Jo and
                  Sunwon Jung and
                  Doo{-}Il Jung and
                  Chan{-}ho Kim and
                  Daewoon Kang and
                  Tae{-}Sung Lee and
                  Byunghoon Jeong and
                  Chiweon Yoon and
                  Dongku Kang and
                  Seungjae Lee and
                  Jungdon Ihm and
                  Dae{-}Seok Byeon and
                  Jin{-}Yup Lee and
                  Sangjoon Hwang and
                  Jai Hyuk Song},
  title        = {A 1.8 Gb/s/pin 16Tb {NAND} Flash Memory Multi-Chip Package with F-Chip
                  of Toggle 4.0 Specification for High Performance and High Capacity
                  Storage Systems},
  booktitle    = {{IEEE} Symposium on {VLSI} Circuits, {VLSI} Circuits 2020, Honolulu,
                  HI, USA, June 16-19, 2020},
  pages        = {1--2},
  publisher    = {{IEEE}},
  year         = {2020},
  url          = {https://doi.org/10.1109/VLSICircuits18222.2020.9163052},
  doi          = {10.1109/VLSICIRCUITS18222.2020.9163052},
  timestamp    = {Wed, 04 Oct 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/vlsic/LeeNKCLYSKLJCJJ20.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/isscc/KimLLNSKYSLRKKP15,
  author       = {Hyun{-}Jin Kim and
                  Jeong{-}Don Lim and
                  Jang{-}Woo Lee and
                  Dae{-}Hoon Na and
                  Joon{-}Ho Shin and
                  Chae{-}Hoon Kim and
                  Seungwoo Yu and
                  Ji{-}Yeon Shin and
                  Seon{-}Kyoo Lee and
                  Devraj Rajagopal and
                  Sang{-}Tae Kim and
                  Kyeong{-}Tae Kang and
                  Jeong{-}Joon Park and
                  Yongjin Kwon and
                  Min{-}Jae Lee and
                  Sunghoon Kim and
                  Seunghoon Shin and
                  Hyunggon Kim and
                  Jin{-}Tae Kim and
                  Ki{-}Sung Kim and
                  Han{-}Sung Joo and
                  Chanjin Park and
                  Jae{-}Hwan Kim and
                  Man{-}Joong Lee and
                  Do{-}Kook Kim and
                  Hyang{-}Ja Yang and
                  Dae{-}Seok Byeon and
                  Ki{-}Tae Park and
                  Kyehyun Kyung and
                  Jeong{-}Hyuk Choi},
  title        = {7.6 1GB/s 2Tb {NAND} flash multi-chip package with frequency-boosting
                  interface chip},
  booktitle    = {2015 {IEEE} International Solid-State Circuits Conference, {ISSCC}
                  2015, Digest of Technical Papers, San Francisco, CA, USA, February
                  22-26, 2015},
  pages        = {1--3},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/ISSCC.2015.7062964},
  doi          = {10.1109/ISSCC.2015.7062964},
  timestamp    = {Sun, 30 Jul 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/KimLLNSKYSLRKKP15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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