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ORCIDInternational Journal of Manufacturing Technology and Management, Volume 7
Volume 7, Number 1, 2005
- John R. Grandzol, Christian J. Grandzol, Shan T. Rippey:
An emerging framework for global strategy. 1-19 - Jian Wang, De-bi Tsao:
A configuration study on the relationships between production systems and business strategy in the changing environment. 20-40 - Olli-Pekka Hilmola
:
Product mix decisions and production lot sizes. 41-51 - Damien Power, Milé Terziovski:
The process, practice and outcomes of non-financial auditing: five Australian case studies. 52-82 - D. Y. Sha, Chao-Yang Liu:
Decision making for shop floor control integration strategies in wafer fabrication using tabu search-based methodology. 83-103
Volume 7, Number 2/3/4, 2005
- M. Ramulu:
Ultrasonic machining effects on the surface finish and strength of silicon carbide ceramics. 107-126 - M. J. Jackson:
Non-traditional machining using pulsed water jets. 127-141 - A. Agrawal, V. K. Jain, K. Muralidhar:
Experimental determination of viscosity of abrasive flow machining media. 142-156 - Sandeep Dhanik, S. S. Joshi, N. Ramakrishnan, P. R. Apte:
Evolution of EDM process modelling and development towards modelling of the micro-EDM process. 157-180 - Arunanshu S. Kuar, B. Doloi, B. Bhattacharyya:
Experimental investigations on Nd: YAG laser cutting of silicon nitride. 181-191 - Yue Jiao, Ping Hu, Z. J. Pei, Clyde Treadwell:
Rotary ultrasonic machining of ceramics: design of experiments. 192-206 - Soham Sarkar, S. Mitra, B. Bhattacharyya:
Wire electrical discharge machining of gamma titanium aluminide for optimum process criteria yield in single pass cutting operation. 207-223 - Muthukuruman Packirisamy, Ion Stiharu, L. Flores:
Roughness characterisation of gas phase micromachining process suitable for fabricating silicon based microsystems. 224-245 - Vinod Yadava, V. K. Jain, Prakash M. Dixit:
Temperature distribution in the workpiece due to electro-discharge diamond surface grinding using FEM. 246-267 - H. Hocheng, P. S. Kao, S. C. Lin:
Generation of erosion profile of through hole in electrochemical boring using a stepwise moving electrode. 268-286 - R. S. Mulik, Vinod Yadava:
Thermal stresses during electro-chemical spark machining. 287-307 - J. H. Zhang, Y. Qin, Q. H. Zhang, Y. J. Hu, S. F. Ren:
Numerical control system for the ultrasonic vibration assisted electrical discharge machine tool. 308-317 - Z. C. Li, Yue Jiao, Timothy W. Deines, Z. J. Pei, Clyde Treadwell:
Development of an innovative coolant system for rotary ultrasonic machining. 318-328 - H. K. Kansal, Sehijpal Singh, Pradeep Kumar:
Application of Taguchi method for optimisation of powder mixed electrical discharge machining. 329-341 - P. K. Brahmankar, N. Ramakrishnan:
On the fatigue characteristics of electro-discharge machined alumina particulate reinforced aluminium matrix composites. 342-351 - Jinjin Zhou, Guibing Pang, Hui Wang, Wenji Xu:
Research on pulse electrochemical finishing using a moving cathode. 352-365 - P. Hemanth, P. V. Naqash, N. Ramesh Babu:
A simplified model for predicting the penetration of an abrasive water jet in a piercing operation. 366-380 - Q. H. Zhang, J. H. Zhang, S. F. Ren, Z. W. Niu, X. Ai:
A theoretical model of surface roughness in ultrasonic vibration assisted electrical discharge machining in gas. 381-390 - Vinay Sharma, Surender Kumar:
A study of process parameters for coal cutting under Indian environmental conditions using a hydro jet cutting system. 391-403
Volume 7, Number 5/6, 2005
- Liqun Zhu, Imin Kao:
Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresaw. 407-429 - Jeremiah A. Couey, Eric R. Marsh, Byron R. Knapp, R. Ryan Vallance:
In-process force monitoring for precision grinding semiconductor silicon wafers. 430-440 - Libo Zhou, Jun Shimizu, Hiroshi Eda:
A novel fixed abrasive process: chemo-mechanical grinding technology. 441-454 - M. B. Cai, X. P. Li, Mustafizur Rahman:
Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon. 455-466 - Muthukkumar S. Kadavasal, Abhijit Chandra, Sutee Eamkajornsiri, Ashraf-F. Bastawros:
Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variables. 467-489 - Libo Zhou, Jun Shimizu, Hiroshi Eda:
Effects of tool stiffness and infeed scheme on planarisation. (Integrated model for simulation of planarisation process). 490-503 - Changxue Wang, Peter Sherman, Abhijit Chandra:
Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation. 504-529 - Lei Dong, John A. Patten, Jimmie A. Miller:
In-situ infrared detection and heating of metallic phase of silicon during scratching test. 530-539 - J. M. Zhang, J. G. Sun:
Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission properties. 540-552 - Iqbal K. Bansal, Mark Surgent:
Fabrication of pin diodes using direct-bonded silicon wafers. 553-565 - Kee S. Kim, Stephen C. Jones, Tami L. Knotts:
Selecting and developing suppliers for mass merchandisers. 566-580 - Reza Tavakkoli-Moghaddam, Masoud Rabbani, Ali Ghodratnama, P. K. Ahmed:
Allocation of parts to cells, minimising tardiness and idle time by simulated annealing. 581-593
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